Patent Number: 6,168,499

Title: Grinding apparatus for semiconductor wafers

Abstract: The present invention provides a grinding apparatus for semiconductor wafers for preventing the silicon powder generated from the wafer grinding process and mixed with cooling water from contaminating height gauges of the grinding apparatus because the silicon powder is scattered toward them, and for preventing wear-down of the contact heads of the height gauges due to the abrasion with a wafer to be fixed on a spin-chuck and the spin-chuck. The grinding apparatus for semiconductor wafers includes a spin-chuck for fixing a wafer to be ground and rotating the wafer; a grinder for grinding the wafer fixed on the spin-chuck by rotating and contacting the wafer over the upper side of the spin-chuck; a first cooling water supply for supplying cooling water between the surface of the wafer to be ground and the grinder; a first height gauge for measuring the vertical distance from a certain standard point to the upper surface of the wafer by using an electric signal generated according to the movement ranges of a contact head which is placed to contact of the wafer fixed on the spin-chuck; and a cover for covering the top and side of the first height gauge so as to protect the first height gauge.

Inventors: Jang; Kwon-yuong (Kyungki-do, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: B24B 49/10 (20060101); B24B 55/00 (20060101); B24B 55/02 (20060101); B24B 7/22 (20060101); B24B 7/20 (20060101); B24B 049/02 (); B24B 007/22 ()

Expiration Date: 01/02/2018