Patent Number: 6,168,500

Title: Monitoring system for dicing saws

Abstract: A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a spindle motor with a blade attached to the spindle motor. A spindle driver is coupled the spindle to drive the spindle at a predetermined rotation rate. A sensor is connected to the spindle motor to determine the rotation rate of the spindle. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

Inventors: Weisshaus; Ilan (Kiriat Bialik, IL), Licht; Oded Yehoshua (Haifa, IL)

Assignee: Kulick & Soffa Investments, Inc.

International Classification: B28D 5/00 (20060101); B24B 049/00 ()

Expiration Date: 01/02/2018