Patent Number: 6,168,501

Title: Grinding method of microelectronic device

Abstract: A method of grinding a microelectronic device includes a step of preparing an abrasive member by crushing a solid-phase liquid into massive form and by compacting the crushed solid-phase liquid, an abrasive member by compacting a solid-phase gas, or an abrasive member by crushing a solid-phase liquid into massive form, by mixing the crushed solid-phase liquid with a solid-phase gas and by compacting the mixed solid-phase liquid and solid-phase gas, and a step of pressing a surface of the microelectronic device to be ground against the abrasive member.

Inventors: Kamijima; Akifumi (Tokyo, JP)

Assignee: TDK Corporation

International Classification: B24B 37/04 (20060101); B24B 001/00 ()

Expiration Date: 01/02/2018