Patent Number: 6,168,502

Title: Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus

Abstract: The present invention provides a method and apparatus for conditioning a polishing pad in which slurry is directed under pressure at the polishing pad. Additionally, energy (i.e., ultrasonic energy) may be added to the slurry as it is directed towards the polishing pad, wherein embedded material in the polishing pad is removed or dislodged.

Inventors: Allman; Derryl D. J. (Colorado Springs, CO), Gregory; John W. (Colorado Springs, CO)

Assignee: LSI Logic Corporation

International Classification: B24B 1/04 (20060101); B24B 37/04 (20060101); B24B 53/007 (20060101); B24B 001/00 (); B24C 005/02 ()

Expiration Date: 01/02/2018