Patent Number: 6,168,508

Title: Polishing pad surface for improved process control

Abstract: A polishing pad for chemical-mechanical polishing of an integrated circuit surface is described. The polishing pad includes a first polishing area having a first value of a physical property; and a second polishing area having a second value of said physical property, which said second value is different from the first value, such that during chemical-mechanical polishing of an integrated circuit surface, the integrated circuit rotates and oscillates on the polishing pad so that a substantial portion of the integrated circuit surface contacts both the first and second polishing areas, wherein a width of said first and second polishing areas is greater than about 40 mils.

Inventors: Nagahara; Ronald J. (San Jose, CA), Lee; Dawn M. (Morgan Hill, CA)

Assignee: LSI Logic Corporation

International Classification: B24B 37/04 (20060101); B24D 13/14 (20060101); B24D 13/00 (20060101); B24D 011/00 ()

Expiration Date: 01/02/2018