Patent Number: 6,168,640

Title: Chemical-mechanical polishing slurry that reduces wafer defects

Abstract: A method of making a chemical-mechanical polishing slurry includes mixing a ferric salt oxidizer with a solution to produce a mixture with a dissolved ferric salt oxidizer, filtering the mixture to remove most preexisting particles therein that exceed a selected particle size, adding a suspension agent to the mixture, and adding abrasive particles to the mixture after filtering the mixture. Advantageously, when polishing occurs, scratching by the preexisting particles is dramatically reduced.

Inventors: Burke; Peter A. (Austin, TX), Beckage; Peter J. (Austin, TX)

Assignee: Advanced Micro Devices, Inc.

International Classification: C09K 3/14 (20060101); C09G 1/00 (20060101); C09G 1/02 (20060101); C09K 003/14 (); B24B 001/00 ()

Expiration Date: 01/02/2018