Patent Number: 6,168,678

Title: Method and device for stacking substrates which are to be joined by bonding

Abstract: A method and an apparatus are proposed in order to bond multilayered substrate packages over a large surface at uniform heating in the course of one single work step, wherein the structured substrates are to begin with aligned to one another with high precision to correspond to the structuring in a working area separate from the heating apparatus.

Inventors: Plankenhorn; Horst (Villingen-Schwenningen, DE), Lindner; Thomas (Konigsfeld, DE)

Assignee: Mannesmann Kienzle GmbH

International Classification: B32B 17/06 (20060101); B32B 17/10 (20060101); H01L 21/70 (20060101); H01L 21/98 (20060101); B32B 031/26 (); B32B 035/00 (); H01L 021/68 (); B65G 049/07 ()

Expiration Date: 01/02/2018