Patent Number: 6,168,683

Title: Apparatus and method for the face-up surface treatment of wafers

Abstract: A polishing apparatus for semiconductor wafers includes an index table with multiple wafer positions, with different surface treatment arrangements for each position. With each index motion of the table, the table is sequentially loaded and unloaded while wafers carried at the remaining stations of the index table are moved for a subsequent surface treatment step. Progress of the surface treatment at each position is monitored and, optionally, subsequent surface treatment steps may be modified to achieve a desired final condition of the substrate being processed.

Inventors: Cesna; Joseph V. (Niles, IL)

Assignee: Speedfam-IPEC Corporation

International Classification: B24B 37/04 (20060101); C23F 001/02 ()

Expiration Date: 01/02/2018