Patent Number: 6,168,690

Title: Methods and apparatus for physical vapor deposition

Abstract: The invention relates to an improved sputter target that is a combination sputter target and induction antenna. In one embodiment, when the sputter target is energized sputter material particles are sputtered away from the sputter target and a plasma is induced. In another embodiment, the sputter target is energized by an energy source. In yet another embodiment, the energy source includes a bias power supply and an induction power supply. The bias power supply applies a potential to the sputter target relative to an object. The induction power supply applies a current to the sputter target. The potential and the current promote the sputtering away of the sputter target, the formation of the plasma and the anisotropic distribution of the sputtered material particles.

Inventors: Jewett; Russell F. (Newark, CA), Benjamin; Neil M. (East Palo Alto, CA), Perry; Andrew J. (Fremont, CA), Vahedi; Vahid (Albany, CA)

Assignee: Lam Research Corporation

International Classification: C23C 14/34 (20060101); C23C 14/32 (20060101); H01J 37/32 (20060101); C23C 014/34 ()

Expiration Date: 01/02/2018