Patent Number: 6,168,693

Title: Apparatus for controlling the uniformity of an electroplated workpiece

Abstract: An electroplating system for plating at least one metal on at least one substrate. At least one plating tank contains a plating solution including the at least one metal to be plated on the at least one substrate. At least one anode is arranged in the at least one plating tank. The at least one anode is at least partially immersed within the plating solution during plating of the at least one metal. At least one cathode includes at least one workpiece portion in contact with the at least one substrate and at least one thief portion arranged in the vicinity of at least one portion of the at least one substrate for controlling plating of the at least one metal on the at least one portion of the at least one substrate. At least one power supply is connected to the at least one cathode. At least one controller separately controls a flow of power to the at least one workpiece portion of the cathode and the at least one thief portion of the cathode.

Inventors: Uzoh; Cyprian Emeka (Hopewell Junction, NY), Landry; Gerard Raymond (New Windsor, NY)

Assignee: International Business Machines Corporation

International Classification: C25D 21/12 (20060101); C25B 009/00 (); C25C 003/20 ()

Expiration Date: 01/02/2018