Patent Number: 6,168,696

Title: Non-knurled induction coil for ionized metal deposition, sputtering apparatus including same, and method of constructing the apparatus

Abstract: An RF induction coil for inductively coupled ionized sputtering applications having at least one extremely smooth surface, on the order of about 30 .mu.m or less, which faces, substantially resides within, or is immediately proximate a plasma field in a sputtering chamber. The smooth induction coil requires only an extremely short burn-in time to remove surface damage and contaminants until a steady-state sputtering rate is achieved. The smooth induction coil may be constructed of target material, or a material distinct from the target material, and can be of any suitable geometry or configuration.

Inventors: Burton; Randle D. (Boise, ID), Meikle; Scott G. (Boise, ID), Schindel; James A. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: C23C 14/34 (20060101); H01J 37/32 (20060101); C23C 014/34 (); C23C 014/42 (); C23C 014/44 (); C23C 014/56 (); H01F 027/28 ()

Expiration Date: 01/02/2018