Patent Number: 6,168,703

Title: Copper foil and laminate containing a hydrogen inhibitor

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Inventors: Lee; Chin-Ho (Lyndhurst, OH), Czapor; Edward (Parma, OH)

Assignee: GA-TEK Inc.

International Classification: C25D 11/38 (20060101); C25D 3/56 (20060101); C25D 9/08 (20060101); C25D 9/00 (20060101); C25D 11/00 (20060101); H05K 3/38 (20060101); B41M 005/20 (); C25D 007/00 (); H01M 004/02 ()

Expiration Date: 01/02/2018