Patent Number: 6,168,744

Title: Process for sequential multi beam laser processing of materials

Abstract: A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.

Inventors: Malshe; Ajay P. (Fayetteville, AR), Ozkan; Arzu M. (Fayetteville, AR), Brown; William D. (Fayetteville, AR)

Assignee: Board of Trustees University of Arkansas

International Classification: B23K 26/00 (20060101); B23K 26/36 (20060101); B23K 26/42 (20060101); B29C 035/08 ()

Expiration Date: 01/02/2018