Patent Number: 6,168,834

Title: Method for dissipating heat

Abstract: A method for increasing the dissipation of heat from one portion of a surface when heat is applied to another portion of the same surface. The preferred composition is a gel or paste with high water content and a thickener of a mineral clay in a colloidal suspension. The invention finds particular use in welding and soldering processes which are carried out adjacent heat sensitive materials.

Inventors: Hallo; Kenneth R. (Greer, SC), Shcld; John L. (Troutman, NC)


International Classification: B23K 35/22 (20060101); C21D 1/70 (20060101); C21D 1/68 (20060101); B05D 003/02 (); H05B 006/24 (); C23C 016/00 (); C09K 021/00 ()

Expiration Date: 01/02/2018