Patent Number: 6,168,910

Title: Method for removing residue and method for production of printed board having hole

Abstract: A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.

Inventors: Hino; Atsushi (Ibaraki, JP), Ishizaka; Hitoshi (Ibaraki, JP)

Assignee: Nitto Denko Corporation

International Classification: B23K 26/06 (20060101); B08B 7/00 (20060101); B23K 26/067 (20060101); H05K 3/00 (20060101); G03F 007/26 ()

Expiration Date: 01/02/2018