Patent Number: 6,169,136

Title: Thermosetting resin potting composition

Abstract: The present invention provides a thermosetting resin potting composition with low melt viscosity and good flowability even though it contains large amount of an inorganic filler containing sphere silica powder as a main component. With this construction, the present invention has solved the problem residing in the prior art that, when the content of an inorganic filler is increased, the viscosity of a potting composition is increased and its flowability is lowered. In the present invention, the sphere silica particles in the inorganic filler have at least one particle group, and the particle group has an average particle diameter of 0.01 to 10 .mu.m and a coefficient of particle diameter variation of 10 percent or smaller. More preferably, the sphere silica particles have two or more particle groups. In this case, the average particle diameter of the larger particle group is 1.4 times or larger than that of its adjacent and smaller particle group.

Inventors: Iriguchi; Jiro (Kakogawa, JP), Yamamoto; Yasuhiro (Himeji, JP), Oishi; Hideki (Himeji, JP), Shimizu; Shuji (Himeji, JP)

Assignee: Nippon Shokubai Co., Ltd.

International Classification: C08K 3/36 (20060101); C08K 3/00 (20060101); C08K 003/00 ()

Expiration Date: 01/02/2018