Patent Number: 6,169,142

Title: Thermal conductive silicone rubber compositions and method of making

Abstract: Silicone rubber parts having a high thermal conductivity and low hardness are obtained by molding and curing a composition comprising (A) 100 parts by weight of an alkenyl-bearing organopolysiloxane having a viscosity of up to about 500,000 centistokes at 25.degree. C., (B) 300-1,200 parts by weight of aluminum oxide powder, (C) 0.05-10 parts by weight of an alkoxysilane of the formula: R.sup.1.sub.a Si(OR.sup.2).sub.(4-a) wherein R.sup.1 is a monovalent C.sub.6-20 hydrocarbon group, R.sup.2 is a C.sub.1-6 alkyl group, and a=1, 2 or 3, (D) a platinum group metal catalyst, and (E) an organohydrogenpolysiloxane containing at least two SiH groups in a molecule. The composition is formulated so as to suppress the viscosity increase of a liquid silicone rubber composition due to heavy loading of aluminum oxide.

Inventors: Nakano; Akio (Usui-gun, JP), Hashimoto; Takeshi (Usui-gun, JP)

Assignee: Shin Etsu Chemical Co., Ltd.

International Classification: C08K 3/22 (20060101); C08K 3/00 (20060101); C08L 83/00 (20060101); C08L 83/04 (20060101); C08K 003/10 ()

Expiration Date: 01/02/2018