Patent Number: 6,169,146

Title: Styrene resin composition and method of manufacturing the same, and method of manufacturing styrene resin molded products

Abstract: Disclosed is a resin composition containing the following components (A), and (B) or optionally, (C), (D), and (E): (A) an atactic polystyrene or a mixture of an atactic polystyrene and a rubber-like elastic substance: 30 to 95 parts by weight; (B) a syndiotactic polystyrene having a melting point of not higher than C.: 70 to 5 parts by weight; (C) a polyphenylene ether having an intrinsic viscosity of 0.5 deciliter/g or less as measured in chloroform at C.; (D) an inorganic filler; and (E) a polymer having compatibility or affinity with components (A) and (B) and having a polar group. The styrene resin composition exhibits improved solvent resistance and remarkable impact resistance. The composition of the invention is produced by kneading the components within a resin temperature range between the melting point of component (B) and C. Resin molded products are manufactured through use of the styrene resin composition by adjusting the resin temperature during molding to fall within the range from the melting point of component (B) to C.

Inventors: Okada; Akihiko (Ichihara, JP), Aoyama; Takuma (Chiba, JP)

Assignee: Idemitsu Petrochemical Co., Ltd.

International Classification: C08L 25/00 (20060101); C08L 25/06 (20060101); C08L 71/12 (20060101); C08L 53/02 (20060101); C08L 53/00 (20060101); C08L 71/00 (20060101); C08L 025/06 (); C08L 025/08 ()

Expiration Date: 01/02/2018