Patent Number: 6,170,432

Title: Showerhead electrode assembly for plasma processing

Abstract: A showerhead electrode assembly for a plasma reactor for processing semiconductor wafers includes a gas plate having a plurality of through holes for passage of gas. The top face or side of the gas plate is of smaller diameter than the bottom side or face of the gas plate. An acutely angled peripheral groove is formed between the top face of the gas plate, and the lower portion thereof, with the groove terminating at a band-like ledge with the top face and lower portion. A locking ring is provided by two identical semicircular sections, each of which include in a lower portion of an inside sidewall, respectively, an acutely angled peripheral groove for mating with the groove of the gas plate. A unitary circular support collar is formed with a circular channel in a bottom portion thereof. These components are joined together by applying an adhesive in the channel of the support collar, mounting the locking ring sections onto the gas plate with the grooves therebetween interlocking, and thereafter forcing the channel of the support collar onto the locking ring sections until the bottom surfaces of the support collar abut against the ledge, and top face or side portion of the gas plate, respectively.

Inventors: Szapucki; Matthew Peter (Toms River, NJ), Kulkaski; Richard (Forked River, NJ), Hadley; Trevor J. (Brick, NJ), Santorelli; Mark Anthony (Barnegat, NJ)

Assignee: M.E.C. Technology, Inc.

International Classification: C23C 16/455 (20060101); H01J 37/32 (20060101); C23C 16/44 (20060101); C23C 016/00 (); H05H 001/00 ()

Expiration Date: 01/09/2018