Patent Number: 6,170,433

Title: Method and apparatus for processing a wafer

Abstract: A semiconductor processing system includes a processing chamber, a rotatable shaft extending into the chamber, and a wafer holder in the chamber. The rotatable shaft has a gas flow passage therethrough. The wafer holder is capable of supporting a wafer in position in the chamber so that the processing gas flow passage directs flow onto a face of the wafer.

Inventors: Du Bois; Dale R. (Los Gatos, CA)


International Classification: C23C 16/455 (20060101); C23C 16/48 (20060101); C23C 16/458 (20060101); H01L 21/67 (20060101); H01L 21/00 (20060101); H01L 21/687 (20060101); C23C 016/00 ()

Expiration Date: 01/09/2013