Patent Number: 6,183,813

Title: Method of staining a semiconductor wafer with a semiconductor treatmentchemical

Abstract: A method for staining a portion of a semiconductor wafer sample with a semiconductor treatment chemical. On embodiment of the method includes gripping the semiconductor wafer sample in a first openly biasable slot in a flexible bar and suspending the semiconductor wafer into the chemical. Other embodiments of the method may further include gripping plural semiconductor wafer samples in openly biasable sots in flexible bars to enable a plurality of semiconductor wafer samples to be treated with a semiconductor treatment chemical.

Inventors: Martini; Frank E. (Boise, ID)


International Classification: H01L 21/67 (20060101); H01L 21/00 (20060101); H01L 21/673 (20060101); B05D 001/18 ()

Expiration Date: 02/06/2013