Patent Number: 6,192,701

Title: Sealed multi-chip module cooling system

Abstract: A cooling system for absorbing thermal energy from an integrated circuit device while preventing the formation of condensation thereon. The cooling system comprises a evaporator unit mounted on an integrated circuit device, housed within an airtight enclosure which is evacuated and then pressurized with dry air.

Inventors: Goth; Gary F. (Pleasant Valley, NY), Loparco; John J. (Poughkeepsie, NY), Singh; Prabjit (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: F25D 19/00 (20060101); H05K 7/20 (20060101); F25D 023/12 ()

Expiration Date: 02/27/2018