Patent Number: 6,200,725

Title: Chemically amplified resist compositions and process for the formation of resist patterns

Abstract: Alkali-developable, chemically amplified resist composition which comprises an alkali-insoluble compound having a structural unit containing a protected alkali-soluble group in which unit a protective moiety of said protected alkali-soluble group contains an alicyclic hydrocarbon group having bonded to a carbon atom thereof a --CH.sub.2 --R.sub.1 ' group wherein R.sub.1 ' is methyl, ethyl, propyl or isopropyl, and said alkali-soluble group is cleaved upon action of an acid generated from a photoacid generator used in combination with said compound, thereby releasing said protective moiety from the alkali-soluble group and converting said compound to an alkali-soluble one, and a photoacid generator capable of being decomposed upon exposure to a patterning radiation to thereby produce an acid capable of causing cleavage of said protective moiety. The resist composition can exhibit a high sensitivity (not more than 5 mJ/cm.sup.2) and therefore is particularly suitable for ArF lithography and also can exhibit stable patterning properties.

Inventors: Takechi; Satoshi (Kawasaki, JP), Kotachi; Akiko (Kawasaki, JP), Nozaki; Koji (Kawasaki, JP), Yano; Ei (Kawasaki, JP), Watanabe; Keiji (Kawasaki, JP), Namiki; Takahisa (Kawasaki, JP), Igarashi; Miwa (Kawasaki, JP), Makino; Yoko (Kawasaki, JP), Takahashi; Makoto (Kawasaki, JP)

Assignee: Fujitsu Limited

International Classification: G03F 7/004 (20060101); G03F 7/039 (20060101); G03F 007/039 ()

Expiration Date: 03/13/2018