Patent Number: 6,241,456

Title: Wafer inspecting apparatus and method

Abstract: This invention provides a wafer inspecting apparatus which enables macroscopic inspection of the entire surface of a wafer. According to the wafer inspecting apparatus of this invention, the edge portion of a wafer 8 is held by suction with the distal ends of wafer holding portions 702 of a wafer holding arm 7, and first-time observation of the lower surface of the wafer 8 is performed. Then, the wafer 8 is transported onto a center table 6. The center table 6 is rotated through a predetermined angle. The edge portion of the wafer 8 is held by suction again with the distal ends of the wafer holding portions 702 of the wafer holding arm 7. Then, second-time observation of the lower surface of the wafer 8 is performed.

Inventors: Kato; Tomoo (Hachioji, JP), Nirei; Tatsuo (Tokyo, JP)

Assignee: Olympus Optical Co., Ltd.

International Classification: B65G 49/07 (20060101); H01L 21/68 (20060101); H01L 21/67 (20060101); G01N 21/956 (20060101); G01N 21/88 (20060101); H01L 21/66 (20060101); B65G 049/07 ()

Expiration Date: 06/05/2018