Patent Number: 6,248,002

Title: Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish

Abstract: A method to prevent the accumulation of particle impurities on the surface of a semiconductor substrate that contains wolfram plugs during the process of polishing the surface of the wafer. The polishing sequence consists of three distinct polishing steps whereby the first two steps use hard polishing pads while the third step uses a soft polishing pad with the application of slurry during the third polish.

Inventors: Wang; Hui-Ling (Hsin-Chu, TW), Kuan; Tong-Hua (Hsin-Chu, TW), Wang; Ying-Lang (Taichung, TW), Lin; Yu-Ku (Hsin-Chu, TW)

Assignee: Taiwan Semiconductor Manufacturing Company

International Classification: B24B 37/04 (20060101); B24B 001/00 ()

Expiration Date: 06/19/2018