Patent Number: 6,250,934

Title: IC package with quick connect feature

Abstract: An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

Inventors: Eskildsen; Steven R. (Folsom, CA), Franz; Jeffrey C. (El Dorado Hills, CA), Brannam; David S. (Cameron Park, CA)

Assignee: Intel Corporation

International Classification: H01R 13/22 (20060101); H01R 13/627 (20060101); H01R 012/00 ()

Expiration Date: 06/26/2018