Patent Number: 6,250,957

Title: Stacked modular jack assembly

Abstract: A stacked modular jack assembly comprises a dielectric housing, a Z-shaped insert retained in the housing, a number of first and second contacts securely received in the housing by the insert, a grounding plate positioned between the first and second contacts and a shield enclosing the housing. The housing forms a rearward extending projection having a number of channels for receiving the first contacts. The insert comprises a body having a number of vertical cavities and a slot proximate the cavities, a tongue having a number of level passages and a tail having a number of notches for further retaining the first contacts. The second contacts are assembled to the insert with mounting portions thereof received in corresponding cavities and retaining portions thereof received in corresponding passages.

Inventors: Chang; Yao-Hao (Tu-Chen, TW)

Assignee: Hon Hai Precision Ind. Co., Ltd.

International Classification: H01R 12/00 (20060101); H01R 12/16 (20060101); H01R 013/66 ()

Expiration Date: 06/26/2018