Patent Number: 6,250,997

Title: Processing machine

Abstract: A lapping or polishing machine which processes the surface of silicon wafer or other work piece by rotating a platen with constant supply of lapping or polishing compound. Said platen of the lapping or polishing machine is connected directly to a direct drive motor and driven by the direct drive motor, and the point to point control of said platen is carried out by a rotary encoder.

Inventors: Hatano; Kazutomo (Ayase, JP), Maruya; Mitsuru (Ayase, JP)

Assignee: Speedfam-Ipec Co LTD

International Classification: B24B 49/10 (20060101); B24B 37/04 (20060101); B24B 007/00 ()

Expiration Date: 06/26/2018