Patent Number: 6,251,000

Title: Substrate holder, method for polishing substrate, and method for fabricating semiconductor device

Abstract: A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.

Inventors: Murakami; Tomoyasu (Osaka, JP), Ikenouchi; Katsuyuki (Toyama, JP), Miyoshi; Yuichi (Osaka, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: B24B 41/06 (20060101); B24B 37/04 (20060101); B24B 041/06 ()

Expiration Date: 06/26/2018