Patent Number: 6,251,150

Title: Slurry composition and method of chemical mechanical polishing using same

Abstract: The present invention provides a slurry composition for chemical mechanical polishing comprising spinel particles having the formula AO.cndot.xZ.sub.2 O.sub.3 wherein A is at least one divalent cation, Z is at least one trivalent cation, and 0.01.ltoreq.x.ltoreq.100. The present invention also includes a method of chemical mechanical polishing the surface of a substrate using slurry compositions that include these spinel particles. The slurry compositions of the present invention provide the desired level of planarization and selectivity for both metal and oxide surfaces. In addition, the slurry compositions of the invention can be prepared such that they are substantially free of alpha phase alumina particles and other high hardness particles to produce a scratch-free polished surface.

Inventors: Small; Robert James (Dublin, CA), Peterson; Maria Louise (Menlo Park, CA), Troung; Tuan (San Jose, CA), Bonneau; Lionel (Cran Gevrier, FR), Drouget; Jean Claude (Annecy le Vieux, FR)

Assignee: EKC Technology, Inc.

International Classification: C09K 3/14 (20060101); C09G 1/00 (20060101); C09G 1/02 (20060101); C09K 003/14 (); C09G 001/02 ()

Expiration Date: 06/26/2018