Patent Number: 6,251,189

Title: Substrate processing apparatus and substrate processing method

Abstract: The present invention is constituted so as to improve a quartz gas supply portion utilized in a normal pressure furnace, and to keep to a minimum the damage incurred by a normal pressure furnace by the shock from an earthquake. Quartz gas supply piping 25 for supplying a reactant gas is connected to a quartz reaction tube 4, which constitutes a furnace body. A stress concentration portion 23 for concentrating stress by prioritizing another location when vibration occurs in a furnace body is formed on this gas supply piping 25. The stress concentration portion 23 is disposed on the side of a source-side gas supply pipe 8, which is in front of a pipe clamp 21 that connects the source-side gas supply pipe 8 to a reaction tube-side gas supply pipe 7 mounted to the reaction tube 4. As a stress concentration portion 23, the simplest of V-grooves can be formed in the circumferential direction.

Inventors: Odake; Shigeru (Tokyo, JP), Matsumoto; Naoki (Tokyo, JP), Morita; Shinya (Tokyo, JP), Tometsuka; Kouji (Tokyo, JP)

Assignee: Kokusai Electric Co., Ltd.

International Classification: C23C 16/44 (20060101); C30B 25/14 (20060101); H01L 21/00 (20060101); C23C 016/00 ()

Expiration Date: 06/26/2018