Patent Number: 6,251,199

Title: Copper alloy having improved resistance to cracking due to localized stress

Abstract: A copper alloy having improved resistance to cracking due to localized plastic deformation and the process of making it. The alloy consists essentially of: from 0.7 to 3.5 weight percent nickel; from 0.2 to 1 weight percent silicon; from 0.05 to 1 weight percent tin; from 0.26 to 1 weight percent iron; and the balance copper and unavoidable impurities. The copper alloy has a local ductility index of greater than 0.7 and a tensile elongation exceeding 5%. Cobalt may be substituted for iron, in whole or in part, on a 1:1 basis by weight. The alloy is precipitation hardenable and useful for electronic applications, including without limitation, connectors.

Inventors: Mandigo; Frank N. (North Branford, CT), Breedis; John F. (Trumbull, CT)

Assignee: Olin Corporation

International Classification: C22C 9/06 (20060101); C22F 1/08 (20060101); C22C 009/02 ()

Expiration Date: 06/26/2018