Patent Number: 6,251,207

Title: Embossing and laminating irregular bonding patterns

Abstract: Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.

Inventors: Schultz; Walter T. (Appleton, WI), Raynor, Jr.; William J. (Appleton, WI), Tanner; James Jay (Winneconne, WI), Biggs; David G. (Neenah, WI), Kressner; Bernhardt E. (Appleton, WI), Perkins; Mark D. (Appleton, WI)

Assignee: Kimberly-Clark Worldwide, Inc.

International Classification: B31F 1/00 (20060101); B31F 1/07 (20060101); B31F 001/07 ()

Expiration Date: 06/26/2018