Patent Number: 6,251,211

Title: Circuitry interconnection method

Abstract: Electrically conductive polymer bumps are formed in electrical connection with circuitry supported by a first substrate. The polymer bumps are bonded with a conductive adhesive to circuitry supported by a second substrate, with the conductive adhesive being in electrical connection with the circuitry supported by the second substrate. Prior to said bonding, an effective amount of ultraviolet radiation is impinged onto the polymer bumps to enhance adhesion of the bumps with the conductive adhesive and electrical conduction between the circuitry of the first substrate and the circuitry of the second substrate. In one implementation, ultraviolet radiation of at least 340 nm is impinged onto conductive polymer bumps prior to subsequent bonding. In one implementation, ultraviolet radiation is impinged onto conductive polymer bumps for a time period less than one minute prior to subsequent bonding. In one implementation, ultraviolet radiation is impinged onto conductive polymer bumps to provide a total ultraviolet radiation exposure of greater than about 50 mJ/cm.sup.2 prior to subsequent bonding. In one implementation, ultraviolet radiation is impinged onto conductive polymer bumps in the absence of ozone other than any produced by said ultraviolet radiation prior to subsequent bonding. In one implementation, ultraviolet radiation is impinged onto conductive polymer bumps in an atmosphere consisting essentially of ambient room air prior to subsequent bonding.

Inventors: Lake; Rickie C. (Eagle, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/02 (20060101); G06K 19/077 (20060101); H01L 23/48 (20060101); H01L 21/60 (20060101); H01L 23/485 (20060101); H05K 3/32 (20060101); H01L 023/48 (); B32B 031/06 ()

Expiration Date: 06/26/2018