Patent Number: 6,251,234

Title: Electroplating machine

Abstract: An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber.

Inventors: Henington; Paul (Tsuen Wan, HK), Li; Kwok Wah (Tai Po, HK), Ng; Kwok Wing (Kwai Chung, HK), Lee; Chi Chung (Tsuen Wan, HK), Huang; Pin Chun (Taoyuan, TW), Lee; Fang Hao (Taoyuan, TW), Marsh; Marlin Vance (New Bedford, MA), Colangelo; Carl John (Framingham, MA)

Assignee: Process Automation International, Ltd.

International Classification: B01F 15/02 (20060101); B01F 5/00 (20060101); C25D 17/16 (20060101); C25D 21/14 (20060101); C25D 5/00 (20060101); C25D 17/12 (20060101); C25D 17/28 (20060101); C25D 21/12 (20060101); C25D 17/00 (20060101); C25D 5/08 (20060101); C25D 17/10 (20060101); H05K 3/24 (20060101); C25D 014/00 (); C25B 009/00 (); B01D 011/02 ()

Expiration Date: 06/26/2018