Patent Number: 6,251,469

Title: Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: wherein R.sup.5 is a perfluoroalkyl alkyl radical; R.sup.6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.

Inventors: Papathomas; Konstantinos (Endicott, NY), Appelt; Bernd Karl (Apalachin, NY), Konrad; John Joseph (Endicott, NY)

Assignee: International Business Machines, Corporation

International Classification: H01L 21/02 (20060101); H01L 23/498 (20060101); H01L 21/58 (20060101); H01L 23/48 (20060101); B05D 005/12 ()

Expiration Date: 06/26/2018