Patent Number: 6,251,502

Title: Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Inventors: Yasue; Toshihiko (Gifu, JP), Hiramatsu; Yasuji (Gifu, JP), Yano; Hideki (Gifu, JP), Ishitani; Yoshifumi (Gifu, JP), Kawamura; Yoichiro (Gifu, JP), Murase; Hideki (Gifu, JP), Suzuki; Ayumi (Gifu, JP), Kawade; Masato (Gifu, JP), Asai; Motoo (Gifu, JP)

Assignee: Ibiden Co., Ltd.

International Classification: H05K 3/46 (20060101); H05K 3/00 (20060101); H05K 3/38 (20060101); B32B 003/00 ()

Expiration Date: 06/26/2018