Patent Number: 6,251,551

Title: Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components

Abstract: The invention concerns a method and a device for treating and processing flat substrates such as silicon slices (wafers) for producing microelectronic components in vertical alignment.

Inventors: Kunze-Concewitz; Horst (D-75446 Wiernsheim, DE)

Assignee:

International Classification: G03F 7/20 (20060101); H01L 21/67 (20060101); H01L 21/00 (20060101); H01L 21/677 (20060101); G03F 009/00 ()

Expiration Date: 06/26/2018