Patent Number: 6,251,557

Title: Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects

Abstract: The invention relates to a photosensitive resin composition for rapid prototyping comprising: a. about 30 wt. % to about 70 wt. % of at least two epoxy resins, at least one of these resins is solid at room temperature and comprises aromatic groups, and at least one of these resins is liquid, having a viscosity at 25.degree. C. lower than about 1,000 Pa.s, b. about 15 wt. % to about 50 wt. % of at least one multifunctional acrylate compound c. about 5 wt. % to about 30 wt. % of a hydroxyfunctional compound d. about 1 wt. % to about 6 wt. % cationic photoinitiator e. about 1 wt. % to about 6 wt. % free radical photoinitiator. The invention further relates to a process for the manufacturing of 3-dimensional objects, known as rapid prototyping, wherein the photosensitive resin composition is used.

Inventors: Lapin; Stephen C. (Waterford, WI), Sullivan; Michael G. (Elgin, IL)

Assignee: DSM N.V.

International Classification: B29C 41/00 (20060101); B29C 67/00 (20060101); G03F 7/00 (20060101); G03F 7/038 (20060101); G03F 007/20 (); G03F 007/028 (); G03F 007/26 ()

Expiration Date: 06/26/2018