Patent Number: 6,251,565

Title: Method of making molds for manufacturing multiple-lead microstructures

Abstract: A method of making molds for use in manufacturing high precision and high density multiple-lead microstructures. If employs microphoto etching process used in semiconductor manufacturing process to project X-ray and ultraviolet light on a photoresist layer through a X-ray co-mask and a generally used mask to produce exposing process. Through etching and electroplating processes, a plurality of identical punch molds may be made. The punch molds are aligned stacked up one upon the other until a desired height is reached. The stacked up punch molds are electroplated to form a lead punch die for producing microparts desired.

Inventors: Yang; Hsi-Harng (ChangHua Hsien, TW), Chou; Min-Chieh (Taipei, TW), Pan; Cheng-Tang (TaiNan, TW), Mu; Chuan-Kang (TaiChung, TW)

Assignee: Industrial Technology Research Institute

International Classification: C25D 1/00 (20060101); C25D 1/10 (20060101); G03F 7/00 (20060101); C25D 001/10 (); G03F 007/00 ()

Expiration Date: 06/26/2018