Patent Number: 6,251,570

Title: Resist developer saving system using material to reduce surface tension and wet resist surface

Abstract: In one embodiment, the present invention relates to a method of processing a semiconductor structure including a resist thereon, involving the steps of exposing the semiconductor structure including the resist to acting radiation; contacting the semiconductor structure including the exposed resist with a solution comprising water and from about 0.01% to about 5% by weight of a surfactant; and developing the resist with a developer.

Inventors: Phan; Khoi A. (San Jose, CA), Subramanian; Ramkumar (San Jose, CA), Rangarajan; Bharath (Santa Clara, CA), Singh; Bhanwar (Morgan Hill, CA)

Assignee: Advanced Micro Devices, Inc.

International Classification: G03F 7/38 (20060101); G03F 7/32 (20060101); G03F 007/32 ()

Expiration Date: 06/26/2018