Patent Number:
6,251,702
Title:
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
Abstract:
An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
Inventors:
Wensel; Richard W. (Boise, ID)
Assignee:
Micron Technology, Inc.
International Classification:
H01L 23/28 (20060101); H01L 21/56 (20060101); H01L 23/31 (20060101); H01L 21/02 (20060101); H01L 021/44 ()
Expiration Date:
06/26/2018