Patent Number: 6,251,702

Title: Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device

Abstract: An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.

Inventors: Wensel; Richard W. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/28 (20060101); H01L 21/56 (20060101); H01L 23/31 (20060101); H01L 21/02 (20060101); H01L 021/44 ()

Expiration Date: 06/26/2018