Patent Number: 6,251,703

Title: CMS coated microelectronic component and its method of manufacture

Abstract: A microelectronic coated CMS component, in particular for an active implantable medical device, and its method of manufacture. The process is applied to a wafer from which will be formed, after cutting, a plurality of CMS components of the CSP type, i.e., having appreciably the same dimensions as those of the chip. The process includes (a) obtaining a wafer (10) on which are formed the chips (12), each chip having a contact pad (16) on at least one side of the chip; (b) sealing on this wafer a cap (18) having openings (20) authorizing an access to the subjacent contact pads of the chips; (c) forming in the cap distinct trenches (22) according to the periphery of each chip; (d) establishing in the openings an electrical connection to the contact pads, these connections (26) emerging through the upper face of the cap; (e) flowing a coating resin (34) into the openings and the trenches; (f) polishing and metallizing the cap; and (g) cutting the wafer thus prepared into individual components.

Inventors: Van Campenhout; Yves (Villeneuve-Saint-Georges, FR), Gilet; Dominique (Antony, FR), Legay; Thierry (Fontenay-les-Briis, FR), Bono; Hubert (Haute-Jarrie, FR)

Assignee: Ela Medical S.A.

International Classification: H01L 21/02 (20060101); H01L 23/28 (20060101); H01L 21/56 (20060101); H01L 23/31 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 06/26/2018