Patent Number: 6,251,706

Title: Method for cooling the backside of a semiconductor device using an infrared transparent heat slug

Abstract: An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate. In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional cooling technique.

Inventors: Paniccia; Mario J. (Santa Clara, CA)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101); H01L 23/373 (20060101); G01R 31/28 (20060101); H01L 023/10 (); H01L 023/34 (); H01L 023/06 ()

Expiration Date: 06/26/2018