Patent Number: 6,251,708

Title: Hybrid frame with lead-lock tape

Abstract: A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

Inventors: Brooks; Jerry M. (Caldwell, ID), Kinsman; Larry D. (Boise, ID), Allen; Timothy J. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/495 (20060101); H01L 23/48 (20060101); H01L 021/44 ()

Expiration Date: 06/26/2018