Patent Number: 6,251,709

Title: Method of manufacturing a cooling structure of a multichip module

Abstract: A cooling structure is provided for a multichip module on which integrated circuit devices (i.e., LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink, thermal conduction blocks and thermal compounds. Recess portions are formed at a surface of the heat sink in connection with the integrated circuit devices of the multichip module. Low melting point metal material such as solder is supplied to interiors of the recess portions of the heat sink. The thermal conduction blocks are partially inserted into the interiors of the recess portions under the condition where the low melting point metal material is heated and melted, so that the thermal conduction blocks temporarily float in the melted material. To avoid heat transfer toward the integrated circuit devices, a heat insulating sheet is provided on the thermal conduction blocks. Then, the low melting point metal material is solidified, so the heat insulating sheet is removed. The thermal compounds are placed on the thermal conduction blocks. Thus, the integrated circuit devices and the thermal conduction blocks are connected together by means of the thermal compounds. Because of temporarily floating of the thermal conduction blocks in the melted material, it is possible to absorb dispersion in heights and slopes of the heat-radiation surfaces of the integrated circuit devices.

Inventors: Yoshikawa; Minoru (Tokyo, JP)

Assignee: NEC Corporation

International Classification: H01L 23/433 (20060101); H01L 23/34 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 06/26/2018