Patent Number: 6,251,743

Title: Method of liquid treatment of microstructures comprising bendable structural members

Abstract: Microstructures, including a plurality of spaced structural members which are bendable under an external force, undergo a treating method using a first treating liquid, to prevent permanent deformation, by removing the microstructure from the first treating liquid to an environment having a pressure less than atmospheric pressure; or moving the microstructure from the first treating liquid to a second treating liquid having a smaller surface tension than the first treating liquid, and then removing the microstructure from the second liquid; or drying the microstructure removed from the first treating liquid by exposing same to a liquid vapor having a smaller surface tension than the first treating liquid; or removing the microstructure from the first treating liquid to the atmosphere, and drying the microstructure using an energy beam of high intensity or an ultrasonic wave.

Inventors: Nakano; Motoo (Kawasaki, JP), Nomura; Hiroshi (Kawasaki, JP), Katayama; Masaya (Kawasaki, JP), Ikeda; Toshimi (Kawasaki, JP), Inoue; Fumihiko (Kawasaki, JP), Ishikawa; Junichi (Kawasaki, JP), Kuwamura; Masahiro (Kasugai, JP)

Assignee: Fujitsu Limited

International Classification: H01L 21/02 (20060101); H01L 21/20 (20060101); H01L 021/20 ()

Expiration Date: 06/26/2018