Patent Number: 6,251,760

Title: Semiconductor device and its wiring and a fabrication method thereof

Abstract: A semiconductor device and a wiring therefor and a fabrication method thereof are disclosed, which are capable of providing a good current driving capability without degrading the characteristic of the semiconductor device by overcoming the problems encountered in the known semiconductor device, and a wiring is implemented by using e semiconductor device fabricated in accordance with the present invention.

Inventors: Son; Jeong-Hwan (Daejon, KR)

Assignee: Hyundai Electronics Industries Co. Ltd.

International Classification: H01L 21/02 (20060101); H01L 21/336 (20060101); H01L 21/28 (20060101); H01L 29/49 (20060101); H01L 29/40 (20060101); H01L 021/320 (); H01L 021/476 (); H01L 021/44 ()

Expiration Date: 06/26/2018