Patent Number: 6,251,765

Title: Manufacturing metal dip solder bumps for semiconductor devices

Abstract: A system and method for forming solder bumps on a surface of a semiconductor device, such as a spherical-shaped semiconductor integrated circuit, is disclosed. Multiple devices are first aligned so that a vacuum chuck can hold all of the devices with an appropriate orientation. The vacuum chuck can then dip the devices into different molten metal compounds to form a plurality of solder bumps. Metal solder materials of different melting points are chosen so that the thickness of the solder bumps are partially controlled by the number of layers of solder metal sequentially grow on the metal pads. Once the solder bumps are grown on the devices, the vacuum chuck can immediately transfer the devices to a tape and reel assembly for further transportation thereof. It can also be easily fed into a tube assembly which protects the spherical shaped semiconductor device with the solder bumps during the shipping process.

Inventors: Fukano; Atsuyuki (Addison, TX), Takeda; Nobuo (Richardson, TX)

Assignee: Ball Semiconductor, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/67 (20060101); H01L 21/60 (20060101); H01L 21/68 (20060101); H05K 3/34 (20060101); H01L 021/44 ()

Expiration Date: 06/26/2018