Patent Number: 6,251,766

Title: Method for improving attachment reliability of semiconductor chips and modules

Abstract: An adhesion pad for adhering a semiconductor chip or a ball grid array module to a supporting substrate includes a stepped or tapered structure. The structure is composed of at least one solder wettable metal or alloy layer having solder deposited thereon. The stepped or tapered structure prevents a fatigue crack from propagating in the X-Y plane above the adhesion pad.

Inventors: Desai; Kishor V. (Vestal, NY), Sarkhel; Amit K. (Endicott, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/02 (20060101); H01L 23/48 (20060101); H01L 21/60 (20060101); H01L 23/485 (20060101); H05K 3/34 (20060101); H05K 1/11 (20060101); H01L 021/44 (); H01L 023/48 (); H01L 023/52 (); H01L 029/40 ()

Expiration Date: 06/26/2018